![]() The actual reflow process involves the flux reducing the surface tension at the junction of the metals to accomplish metallurgical bonding, allowing the individual solder powder spheres to combine and melt. It is here that the solder is caused to melt and create the required solder joints. Reflow: The reflow area is the area of the soldering process where the highest temperature is reached.The other is to remove the solder paste solvents or volatiles and to activate the flux. One is to ensure that any areas that are not adequately heated because of shadowing effects come up to the required temperature. Here the card is maintained at temperature for two reasons. Thermal soak: Having brought the board up to temperature it next enters what is often termed a thermal soak area.The temperature rise rate that is often used for infra-red reflow soldering is between 2 and 3☌ per second, although rise rates down to 1☌ per second may be used on some occasions. If the board is brought u to temperature too slowly then the board may not reach the required temperature. ![]() If the rate is too high, then the board or the components may be damaged by the thermal stress.Īdditionally if the printed circuit board is brought up to temperature too quickly then areas may not reach the required temperature because of the thermal mass.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |